Markem 699x Ink Formula Change 
MSDS (PDF) 

Background and Scope:
Due to supply problems, Markem Corporation will begin using a new resin in the manufacture of the 699x-series inks that are supplied to Xandex as of March 12, 2001. The change will apply to all Markem 6990, 6993, and 6997 inks. The purpose of this document is to provide information on testing that was done by Xandex in order to confirm that the coming raw material change will yield inks that meet all the required performance criteria and are equivalent in every way to the original formulas.

Markem Test Results
Markem has performed testing of the new resin and inks formulated using the resin. The new resin "...was compared to the existing resin using FTIR and found to be identical." For more information from Markem, visit www.markem.com or follow this link to the Markem contact information page.

Xandex
Test Results:
All Xandex test results indicate that the new formulas are one-for-one replacements for the original formulas. For more information on test parameters used, contact Xandex Customer Service.  The following is a summary of the testing that was performed:
Ink Characteristic*Test Result
ViscosityEqual to Standard 
Dot Size (DM-1, all cartridge sizes)Equal to Standard 
Dot Size (DM-2, all cartridge sizes)Equal to Standard 
Dot Shape and ConsistencyEqual to Standard 
Shelf LifeEqual to Standard 
Debris LevelEqual to Standard 
AdhesionEqual to Standard 
Solvent Resistance (tested both after soft cure @ 85o C and hard cure @ 170o C): 

Isopropyl Alcohol:
Acetone:
M-Pyrrol:
DieMark Remover:
Markem 540:
Aptek 6515:

Equal to Standard
Equal to Standard
Equal to Standard
Equal to Standard
Equal to Standard
Equal to Standard 
Mileage (DM-1 and DM-2)Equal to Standard 
Heat Resistance (180o C, 30 minutes)Equal to Standard 
Ionic LevelsEqual to Standard 
Dot CrackingNone Observed
Hot Chuck PerformanceEqual to Standard 
Backflow (DM-1 only)None Observed
Ink Build-Up on the NeedleEqual to Standard
Cartridge CloggingNone Observed

* All ink dot characterization testing performed at ambient temperature of 70° degrees F, relative humidity of 50% using polished, unetched silicon wafers (no passivation)

 

 

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