| Ink Curing | | Xandex 8103 & 8104 |
| Mode | Hard Cure | | Temperature | Ambient temperature, or heated; Not affected by temperatures up to 150 degrees C. | | Time* | Varies by dot size – Approximately one minute per mil of diameter, up to 15 mil at ambient temperature. | | Result | Ink is highly resistant to most post-probe processes. | | Note: Phenoxy inks that have air-dried will not smear when touched. 8103 and 8104 are highly resistant to most post probe handling and processes. A room temperature cure will give good results for the vast majority of applications. In applications where the ink will be subjected to very harsh process conditions or if the ink is not giving acceptable adhesion results, a cure of 150 degrees C for 30 minutes is recommended. |  |
| Markem® 6990, 6993, 6997 | | Mode | Soft Cure | | Temperature | 100-150 Degrees C | | Time | 5-15 Minutes | | Result | Ink is semi-permanent and will not withstand wash of alcohol, acetone, or photoresist removers. | | | Mode | Hard Cure | | Temperature | 150-185 Degrees C | | Time | 30-60 Minutes | | Result | Ink is highly resistant to most wash processes. | | Note: Phenoxy inks that have air-dried will not smear when touched. These inks should be cured/baked within 2 hours of inking to reduce risk of cracking. | |
| Xandex 7824 and 7824T | | Mode | Hard Cure | | Temperature | Ambient temperature, or heated – Not affected by temperatures up to 150 degrees C. | | Time * | 2.5 hours +/- .25 hours for 15-20 mil dots at ambient temperature OR 5-10 minutes under heat lamp (150 watt @ 5-6 inches) or oven at 115 degrees C for 10 minutes. | | Result | Ink is highly resistant to most post-probe processes. A room temperature cure will give good results for the vast majority of applications. In applications where the ink will be subjected to very harsh process conditions or if the ink is not giving acceptable adhesion results, increasing the cure temperature and time to 150 degrees C for 30 minutes is recommended. | | |
| Markem® 7224 | | Mode | Hard Cure | | Temperature | 125-150 Degrees C | | Time | 30-45 Minutes | | Result | Ink is highly resistant to most wash processes. | | Note: Air-drying or soft cure are not recommended for 7224. | |
Ink Removal
A rinse with isopropyl alcohol or acetone generally removes all inks completely, if wafer is washed immediately after probing. Xandex highly recommends DieMark® Ink Remover 8000 for all inks. For best results use full strength. Procedure A - Apply sparingly with an eyedropper to a localized area of the wafer that needs to be cleaned.
- Allow DieMark® Ink Remover 8000 time to soak the ink dots (average time: 2-3 minutes). The time required will vary depending on the ink dot curing time and/or temperature.
- For highly cured or oven dried ink spots, use longer soak times, and wipe gently with a clean lint free cloth to facilitate removal. If necessary, repeat the above steps.
- For removal of ink from a large area, or from the entire wafer, soak a clean lint free cloth with DieMark® Ink Remover 8000 and apply the wet cloth onto wafer surface. Allow time to saturate the ink dots. Wipe afterwards.
- When desired ink spots have been removed, rinse wafer surface via standard procedures, such as vapor degreasing, and/or rinse with a clean solvent (Isopropyl Alcohol). A DI water rinse is recommended to remove trace solvent residue. A bake cycle at appropriate temps may be preferred to vaporize any organic residue left from rinse solvent.
Procedure B (Follow these steps if thorough removal of all trace residue is required) - Ultrasonic bath of DieMark® Ink Remover 8000
- Wash wafer for 1-5 minutes
- Ultrasonic bath of acetone for 2 minutes
- Rinse with D.I. water
- Rinse with isopropyl alcohol
- Check under 30X or 40X magnification. If any residue remains, repeat the process keeping the solvent bath low (1-2 minutes)
- Air dry
Note: a gentle swipe using a lint-free cloth or tissue may be necessary to remove all traces of residue. Xandex DieMark® Ink Remover 8000 may also be used in ultrasonic or circulating baths. This product accommodates other unique wafer cleaning methods such as step temperature and pressure ramping. Compare your cleaning equipment's solvent requirements with DieMark Remover to assure compatibility and safety before use. MSDS (pdf 22Kb) |  | | Based on customer feedback, here are additional methods that have proven effective. Methyl Ethyl Ketone (MEK) or N-Methyl-2-Pyrrolidone (M-Pyrrol); follow these steps: - Ultrasonic bath of warm solvent (40-50 Degrees C).
- Wash wafer for 1-5 minutes.
- Ultrasonic bath of acetone for 2 minutes.
- Rinse with D.I. water.
- Rinse with isopropyl alcohol.
- Check under 30X or 40X magnification. If any residue remains, repeat the process keeping solvent bath low (1-2 minutes).
- Air dry.
| | Markem® 540 Cleaner (Not recommended for 8103 ink) – follow these steps:- Ultrasonic bath of warm solvent (40-50 Degrees C).
- Wash wafer for 30-60 seconds.
- Rinse with D.I. water.
- Rinse with isopropyl alcohol.
- Air dry.
| | Aptek® Remover #6515 – follow these steps:- For best results use full strength.
- Apply sparingly with an eyedropper to a localized area of the wafer.
- Allow Aptek® 6515 time to solvate the ink spots (2-3 minutes). Time required will vary depending on the time and temperature that the epoxy was cured.
- For highly cured ink spots, use longer soak times, and wipe gently with a clean lint free cloth to facilitate removal. If necessary, repeat steps 2, 3, and 4.
- For large area or removal of ink from total wafer area, soak a clean lint free cloth with Aptek and lay wet cloth onto wafer surface. Allow time to soak/solvate ink. Then remove cloth and wipe dry.
- When desired ink spots have been removed, clean wafer surface via standard procedures, such as vapor degreasing, and/or rinse with a clean solvent (Isopropyl Alcohol) followed by a bake cycle at 65° C to dry.
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