Introducing the XZIF Interconnec

Introducing the XZIF Interconnect
The Xandex Zero Insertion Force interconnect (XZIF) is an innovative design solution to the challenges of high pin count semiconductor test interfacing that reduces total interface costs. A radical departure from traditional spring probe compliant connections and backplane connectors, XZIF changes the direction of contact force applied at the DUT and Instrument boards. This change in direction of contact force enables the XZIF interconnect to reduce DUT board distortion, by nearly 90% compared to a comparable spring probe array. The XZIF interconnect utilizes interposer technology capable of greater than 18 GHz bandwidth at -3 db attenuation to provide a tunable electrical path suitable for a wide range of memory and SOC device specifications. XZIF is also a high density, long life contact capable of greater than 10,000 mate/demate cycles.
	More XZIF Information
	CLICK Here to view a FLASH animation of the XZIF connection cycle Click Here for XZIF Data Sheets and Specifications. (PDF) Click Here to view an XZIF overview presentation.(HTML: This presentation is optimized for Internet Explorer: will not display correctly in Firefox) Click Here to view Roger Sinsheimer's SouthWest Test Workshop 2006 Presentation on XZIF (PDF 10Mb)
Contact a Xandex ATE account representative for more information. XZIF: Xandex Zero Insertion Force Interconnect The first generation XZIF interconnect was introduced and displayed at Semicon Japan 2003 (view press release here: English / Japanese) and is in worldwide use on a leading ATE memory test platform. The second generation Xandex Zero Insertion Force interconnect (XZIF) is an improved XZIF solution with increased electrical performance for a wider range of test applications, longer life cycle and greater power handling capability. A radical departure from traditional spring probe compliant connections and backplane connectors, the XZIF interconnect design utilizes interposer technology to replace both spring probes and pin/socket connectors. XZIF offers significant cost savings over traditional interconnect systems and provides the higher densities and parallelism required by next generation ATE platforms. XZIF can reduce compliant connection costs by 50% in spring probe interfaces with the same pin count. Interposer technology provides a tunable electrical path and a reliable, durable contact capable of over 10,000 mate/demate cycles. Because there is no spring probe compression required, XZIF exhibits extremely reliable contact resistance without the need for a high force mechanical or vacuum coupling mechanism.

Introducing the XZIF Interconnect