Modular Spring Probe Interface Blocks
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Xandex designs and manufactures modular spring probe  assemblies for use in wafer probe and final test applications. Each probe module contains one or multiple arrays of spring probe terminated transmission lines, where each array corresponds to one device test site.  In this regard, each probe module is an individual test interface. 

Probe module form factor and performance are based on individual test platform requirements.  Xandex collaborates with the design and development teams at leading Automated Test Equipment (ATE) manufacturers to create spring probe modules that meet and exceed the bandwidth and signal integrity requirements of current and next generation device types. 

Signal probe modules on the left and right of a Utility probe module (center) in a wafer probe interface tower.

Design: The Anatomy of a Probe Module

As an electrical interface the Xandex probe module consists of three main sections; the probe block, the transmission line and the transmission line termination.

The probe block is the probe card facing section of the module, and consists of  a plastic housing and a metal spring probe insertion plate.  The housing provides features for mounting the probe module and retains the metal plate which also serves as the ground plane for the interface.  

The middle section of the module, the transmission lines, are press fit into holes milled into the metal plate. Ground recepacles are also pressed into holes in the metal plate.  The flexible transmission line cables are terminated in connectors appropriate to the performace and serviceability requirements of the test system.  

On the tester side of the module, the transmission line cable termination connectors can be grouped in plastic carriers for connection, routed individually to mating connectors on the backplane or directly to the test electronics boards.

Probe Spacing and Ground Isolation

Minimum signal to signal probe pin spacing in Xandex probe modules utilizing the Xandex Spring Probe and Receptacle is 0.090 inches (2.29 mm).  Minimum signal to ground pin spacing is 0.070 inches (1.78 mm).  

The probe module diagram on the right illustrates an array of signal, ground and power/utility channels that utilizes three and four pin ground isolation per signal channel.  By enlarging the form factor of the module only slightly, complete four ground pin isolation per signal chanel could be implemented, providing increased performance.

Vacuum Capability

Vacuum capability can be incorporated into probe modules, enabling them to be used in vacuum interface designs.  Click Here for more information on Xandex vacuum interface technology.

Electrical Performance

The electrical performance range of probe blocks is greatly influenced by the transmission line backplane / probe electronics connector.  Depending on the connector chosen, the resulting bandwidth range of Xandex blocks is 3 GHz at –3 dB to 10 GigaHertz at –3dB.  Signal to signal probe spacing of 2.5 mm is standard, with +3 å return loss (VSWR) of -10 dB @ 2.8 GHz and -10 dB @ 8.8 GHz. *  RF capability is also available up to 18 GHz at –1 dB and +3 å return loss (VSWR) of -13 dB @ 20 GHz. 

Click Here to view specifications for Xandex Transmission Line Cables.