| INK TERMS Adhesion: The state in which an ink dot is held to a substrate by interfacial forces. The degree of adhesion varies depending on the composition of the ink, composition of the substrate, amount of surface contamination, and ink cure temperature. The degree of adhesion can be determined by measuring the amount of force per unit area required to remove the ink from the substrate. Air Dry: An ink that does not require heat curing. Air drying ink formulations supplied by Xandex are the 7824, 8103, and 8104 types. Drying times vary depending on dot size, ink type, and ambient temperature. Appearance: General term relating to the quality and consistency of the ink dots. Examples: Round shape vs. irregular shape, transparency vs. opacity, consistent dot to dot size vs. inconsistent dot to dot size. Contamination: Any material present on the substrate that affects the ink adhesion and/or spreading behavior. Contamination may be organic or inorganic. Indicators of possible contamination problems are inconsistent dot size/shape and poor adhesion. Curing: The mechanism by which liquid ink is transformed into a solid. The two curing mechanisms associated with Xandex inks are polymerization and solvent evaporation. Polymerization occurs when individual molecules (monomers) bond together to form a continuous network (a polymer). The 7224 series inks cure via heat accelerated polymerization of epoxy monomers. All other inks sold by Xandex cure by solvent evaporation. Solvent evaporation curing occurs when the liquid components in the ink evaporate, leaving only the solids. Depending on the volatility of the solvents used in the formulation, the ink will be either air curing or require an oven cure. Donut: Reference to a dot that is greater in thickness at the edges than at the center. Usually associated with an improper inker Z-height adjustment. Dot Profile: A description of the dot dimensions. Included in the dot profile are dot diameter, dot height, and any height irregularities (e.g. donut shaped). Dry Time: For air drying inks, the amount of time required for an ink dot of a given size to dry. Small dots have a faster dry time than larger dots. Dye: Organic colorants used in the majority Xandex ink formulations. Most dyes are soluble synthetic organic materials, as opposed to pigments which are generally insoluble inorganic materials. Inks made from dyes are less opaque than those made from pigments. Epoxy: Resin type used in the 7224 ink formulations. Inks made with epoxy resin cure by polymerization, and the result is a very hard ink film with good solvent resistance and adhesion. Flash Point: Temperature above which vapors of a substance become sufficiently concentrated to cause an explosion when exposed to a spark or open flame. Grind: A measure of the level of undispersed particles in the ink as measured using a grind gauge. Ink: A liquid blend of materials used to impart color to a substrate. The basic components of an ink are colorant (dye or pigment), solvent, and resin. Ink Performance Characteristics: The characteristics inherent in a particular ink formulation. Adhesive strength, degree of solvent resistance, cure rate, and shelf life are all examples of ink performance characteristics. Ink Balling: Phenomenon in which ink works it’s way up the exterior of the cartridge needle and forms a mass. If the mass becomes large enough it can drop onto the substrate being inked. Ink balling can result from repeatedly actuating the inker when the Z setting is too high to allow ink droplets to deposit onto the substrate normally. When ink balling occurs, simply wiping all the excess ink from the outside of the needle is usually an effective solution to the problem. Ionic: Relating to charged atomic species. Low ionic levels of Chloride (Cl) and Sodium (Na) are an important characteristic of inks used in Xandex ink cartridges. Mobil Ions: Ions which are not bound to any other atomic species and are free to move under the influence of an electric charge. At high enough concentrations, mobil ions will cause shorts in semiconductor devices. To avoid the potential of ionic contamination, many Xandex inks are certified to have low ionic levels of Chloride (Cl) and Sodium (Na). Material Safety Data Sheet (MSDS): Detailed reference sheet that outlines the hazards, physical properties, required precautions, first aid measures, and regulatory information associated a chemical or chemical mixture. An MSDS is required for all chemicals and chemical mixtures sold commercially. Opacity: The optical density of a material; the opposite of translucency. An ink droplet of high opacity does not transmit much light and is able to hide the patterning of the wafer beneath it. Opaque: A substance is said to be opaque if it possesses a high optical density that prevents the transmittance of light. Open Time: After priming, the amount of time an ink cartridge can remain viable before clogging begins to occur at the needle tip. Permanency: The relative degree of difficulty involved in ink dot removal. For example, hard cured ink dots have more permanency than soft cured ink dots. Phenolic: Relating to a class of aromatic organic compounds in which one or more hydroxy groups are attached directly to the benzene ring. The majority of the inks supplied by Xandex are phenolic in character. Pigment: A substance that imparts color to another substance or mixture. Most pigments are insoluble inorganic powders, the coloring effect being a result of their dispersion in a solid or liquid medium. Polymerization: A chemical reaction, usually carried out with a catalyst, heat, or light, in which a large number of relatively simple molecules (monomers) combine to form a chain-like macromolecule (a polymer). Epoxy type inks cure via polymerization. Resin: A semisolid or solid complex amorphous mix of organic compounds. Resins are one of the main component in all inks. They are sometimes referred to as the "body" of the ink since the composition of the cured ink film is primarily resin. Choice of resin has a large effect on characteristics of the ink such as ink film hardness, permanency, and tolerance to high temperatures. Rheology: Science of the deformation and flow of materials in terms of stress, strain, and time. Has important bearing on the behavior of viscous liquids. Shear: The ratio between a stress (force/unit area) applied laterally to a material and the strain resulting from this force. Determination of this ratio is one method of determining the viscosity of an ink. Shelf Life: The maximum amount of time a material will last before there is a noticeable degradation in physical characteristics and performance in an application. Solvent: The liquid component of an ink. Solvents used in Xandex inks are primarily various types of glycols and alcohols. Specific Gravity: The ratio of the density of a substance to the density of some reference substance, usually water. Splatter: Phenomenon that sometimes occurs in DM-1 cartridges in which a small (1 to 5 mil) ink dot splatters onto the substrate at the same time as the primary ink dot. The cause is not fully established, but may be related to improper z-height adjustment and/or certain defects in the "fishline" portion of the cartridge needle tip. Strength: A measure of the level of colorant present in the ink. Strength is usually measured against a standard of known colorant level. Surface Energy: The attractive force exerted by a surface. The higher the surface energy, the greater the tendency of a liquid to spread across the surface. Inks will generally have better adhesion on high surface energy substrates. Surface Tension: In any liquid, the attractive force exerted by molecules below the surface upon those at the surface/air interface, resulting from the high molecular concentration of a liquid compared to the low molecular concentration of a gas. Inks with a high surface tension have less tendency to spread across the surface of a substrate. Thermosetting: Mechanism by which some epoxy inks cure via polymerization under the influence of heat. Mode of curing for Xandex epoxy inks. Thickener: Ink component added to increase the ink viscosity. Usually a combination of fumed silica, resin, and solvent. Thixotropy: The ability of certain inks to liquefy when agitated (as by shaking or ultrasonic vibration) and to return to a more gelled form when at rest. An important ink performance characteristic in some applications. Translucency: The ease with which light can be transmitted through a substance. The greater the translucency of a substance, the more light can be transmitted. Viscometer: A device for measuring the viscosity of a liquid. The Brookfield viscometers used for ink qualification at Xandex measure the amount of resistive force encountered by a rotating spindle when immersed in the ink. Viscosity: The internal resistance to flow exhibited by a fluid, the ratio of shearing stress to rate of shear. Achieving the proper viscosity specification is important in ensuring good ink performance.
Inker Hardware Terms Actuate: To put into action or motion. In an inker application, the firing of either the solenoid or pneumatic shuttle on a signal from the prober.Actuator: See solenoid.Cartridge Body: The main plastic portion of the cartridge.Coil: See solenoid.Connector: A mechanical device, which provides a link between individual apparatus for the purpose of transferring electrical signals, gases, and fluids between the apparatus.Filament: A fine threadlike component that passes through the center of the cartridge and acts as a carrier for the ink to the wafer surface.Fishline: See filament.Holder: That portion of the inker mechanism that retains the ink cartridge.Holder Base Assembly: The assembled holder, solenoid, plunger, and cartridge clip.Inker Kit: A complete inker setup including everything necessary to install and operate the inker. Including, but not limited to the inker, controller, regulator, cartridge wrench, cartridge opening tool, product manual, etc.Inker Base: The main inker mechanism which the holder or shuttle mounts to and which provides positional adjustment.Joystick: The handle on the inker base used for positioning of the ink cartridge.Main Guide: The cartridge component which retains the filament and attaches to the solenoid plunger allowing transfer of ink to the wafer surface when the solenoid is actuated.Manipulator: A mechanism that facilitates the control of position.Mounting Plate: A metal plate (usually aluminum or steel) for mounting the inker to the prober.Needle: The stainless steel component of the cartridge, which retains and supports the Teflon tube.Plunger: The portion of the solenoid that actuates the filament component of the cartridge resulting in the dispensing of ink dots.Retrofit: To substitute existing equipment or components with up to date replacements.Solenoid: The part of the inker that actuates the plunger, utilizing the flow of an electric current, corresponding with a signal from the prober.Tungsten: A fine metal wire, which passes through the center of the cartridge and acts as a carrier for the ink. It is used in place of the filament when there is a requirement for making smaller dots than the filament is capable.
INTERFACING TERMS Calibration Bar : A structural link used to hold precise tolerances between remotely mounted components.Device Under Test (D.U.T.): The semiconductor device or devices which is/are currently being tested by the Tester.Docking: The act of lowering the test head onto the prober, aligning it and locking it into position for test. Docking aligns the Test Head (Load Board), Interface Tower, and Probe Card, compressing spring loaded contactor pins in the Interface Tower between the Load Board and Probe Card. This completes the electrical interface between the Tester and the Probe Cards Needles.Docking Bars : Bars mounted either to the prober head plate or prober insert ring. Roller bearings integral to the bar engage with cams integral to the PTI.Docking System: A combination of mechanisms and hardware which are assembled to the PTI and prober. The system engages and final aligns the PTI to the head plate, and compresses the spring contactor pins against the probe card. The PTI Linear Cams and handle linkages are part of this system. "Floor" or "House" Facilities: Pressurized air, vacuum and electrical service provided by the sort floor. Handler: An electro mechanical machine that is designed to move, position and sort packaged devices (chips that have been cut from a wafer, bonded with wire connectors and packaged with insulating material) during package test. Head Plate: AKA Ring Carrier: plate at the top surface of the prober which locates and supports the Mechanical Interface. Load Board: A custom made printed circuit board which is attached to the Test Head and allows electrical interface of the Tester electronics to the Interface Tower. Manipulator: A carriage which supports and allows movement of the Test Head. A manipulator may be as simple as a hinged support frame or use counterbalancing weights, hydraulics, drive motors or a combination of all three to offset the weight of the Test Head and cable bundle and allow it to be moved into and out of docking position with a prober or handler. Mechanical Interface: Consists of a set of mounting hardware either built into or bolted to the Head Plate which has the function of holding the Probe Card in the correct X, Y, Z and q position relative to the wafer chuck. Typically includes accessory hardware mounted to top surface of the head plate designed to align the PTI to the Probe Card. PCLBA (Probe Card/ Load Board Assembly): This Xandex designed assembly locks together the Probe Card (and stiffener), Load Board and Prober Tester Interface into a compact package that can be loaded into the prober and locked into test position as a complete unit. Pitch, Roll and Yaw: Rotational motions around the three Cartesian axes. Nod your head to signify Yes, that’s Pitch (motion around the X-axis). Try to touch your left or right ear to your shoulder, that’s Roll (motion around the Y-axis). Shake your head No, that’s Yaw (motion around the Z-axis). Combined with X, Y and Z-axis motion, these motions collectively make up the six types of motion a body moving in 3-space can exhibit. Pitch and Roll are sometimes described together as "tumble."Pogoä Pins: Used synonymously with Spring Contactor Pins.Probe Card: Printed circuit board with needles, blades or probes attached which provides the electrical interface between the Device Under Test (D.U.T.) and the Spring Contact Array in the PTI. Probe Card Needles: Bonded to the a Probe Card, the needles or probes are arranged in a specific pattern to contact the pads on an individual chip (die or DUT) to transmit a test signal to the die before it is cut from a silicon wafer. Probe Card Stiffener: A ring, usually machined out of aluminum or stainless steel, which is fastened to a Probe Card. The Stiffener supports and protects the probe card and contains alignment features for positioning the Probe Card in the Insert Ring or Super Stiffener. Probe Tips: The end of the needles, blades or probes which are mounted to the Probe Card which make contact with the die bonding pads on the D.U.T. Prober: A general term for a wafer prober; a device which handles, transports and positions silicon wafers during the test process. Prober-Tester Electrical Interface: See PTI.PTI: Prober-Tester Interface. Makes the controlled impedance electrical connection between the Test Head and the Probe Card. Has minimal capacitance, inductance and DC resistance.PTI Cables: High-speed controlled-impedance (50 W) environment low capacitance shielded cables which connect the PTI to the Test Head.PTI Linear Docking Cams: Linear Cams on either side of the interface used to secure the interface to the head plate.PTI Docking Cam Handles: When rotated the Docking Cam Handles activate or deactivate the Linear Cams.PTI Cable Management Area: Space inside the PTI used to securely restrain cables in an organized and easily accessible manner.Spring Contact Array: Array of spring contactor probes (pins) making the electrical connection from the PTI to the Probe Card. Mounted inside the PTI.Tester: A piece of electronic equipment designed to test chips to check if they work, and if so, how well (usually how fast) they work. Testers are usually specialized as either memory chip testers, digital logic chip testers, or analog chip testers, though some of the more sophisticated testers can deal with more than one of these groups. Test Head: The moveable portion of a Tester system, connected to the Tester using cables. The Test Head is positioned using a Manipulator and Docked to a Wafer Prober or Handler. The Test Head contains electronics for testing silicon devices and routes signals back to the Tester to evaluate the device under test. The Load Board is usually mounted to the Test Head. X, Y, Z and Theta : Motions relative to the center of the Probe Card as viewed from the front of the prober. +X is motion to the right, +Y is motion away from the operator, +Z motion is vertical motion up from the Head Plate, and + theta is counter-clockwise angular motion around the Z axis, as viewed from above the Head Plate.
AUTOLOADER TERMS Arm: Bracket which holds the hand.AutoLoader: AKA probe card changer. Device for the mechanized change-out of probe cards.Cam Locking Cylinder: Forces the Cam to rotate in a clockwise direction, lifting the Super Stiffener off of the Arm and into testing position. Locking force pushes the Super Stiffener up against the "Z"-stop in the Theta Ring assuring that no slack will cause an error in positioning the probe card.Cam Ring: Mounted inside the Theta Ring, rotated by the Cam Locking Cylinder, this ring locks the Super Stiffener in place for testing.Data Collection: The ability to collect and recall touch-downs, theta correction and other use history of a probe card. Can be accomplished using the Touch Memory unit, or bar code and a test floor network, or both.External I/O: A suite of commands to operate the AutoLoader with commands from the tester or the prober over IEEE-488 or RS-232C.Motorized Theta: On testers which use theta as a part of their probing methodology, allows for faster probe-to-pad alignment by recalling theta offset data from previous uses of a particular probe card, recovered via the Data Collection feature. Operators can manually set theta angle by pushing buttons on the Remote Control.Hand: The Hand which is attached to the end of the Arm carries the Stiffener and Probe Card between the Theta Ring and the outside of the Prober.Remote Control: Control Panel for AutoLoader which is connected to the System Controller. Has input buttons and a display for operator interaction.Super Stiffener: Adapter device which carries the probe card and standard stiffener into the test area and retains the probe card and standard stiffener during the wafer testing process.System Controller: PC-clone based custom controller for AutoLoader.Theta Ring: Adapter between the Ring Carrier and the Cam Ring which allows for theta motion without "Z"-motion. Supports and restrains the Cam Ring.Transport Assembly: Combination of X-slide, Z-slide, and Arm.Touch Memory™: Watch-battery-sized device contains a real-time clock and 4,096 bytes of NVRAM used to collect and store data.Touch Memory Read Station: Box with slot in side which provides a means of interface between the Touch Memory unit mounted on a probe card storage box and the System Controller.X-slide: Part of Transport Assembly. A pneumatically-driven slide which allows for motion in the X-axis from left (-) to right (+), when standing in front of the prober.Z-Slide: Part of Transport Assembly, a pneumatically driven slide which allows for motion in the Z-axis (up and down). | 
