Second Generation XZIF Interconnect
Now for Memory AND SOC Test!
 
The Second Generation XZIF  (Xandex Zero Insertion Force) Interconnect is the latest innovation in interconnect design by Xandex.

XZIF is changing the direction of test interfacing by turning contact force on its side, enabling massively parallel test with ZERO board deflection.

Tunable electrical performance makes XZIF the ideal solution for both High and Low Speed Digital Test with a high current carrying capacity that can handle any power requirement.

Click Here for more information on the revolutionary XZIF Interconnect and change the direction of YOUR Test Interface towards the future!

 

News and Events

Xandex Moves Up in NorthBay biz Top 500 Companies List
Xandex Introduces XZIF Interconnect at Semicon Japan

Xandex Announces Direct Sales of DieMark Products to Europe

Xandex Receives ISO 9001:2000 Certification from NSAI
Xandex recognized for support of US National Guard and Reserves

 

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